Solder Paste Inspection

The need in solder paste inspection

Printing process responsible for over 60% of end line defects.

The solder paste inspection system ensures early detection of paste defects and continuous monitoring of the printing process. The use of SPI will reduce a repair cost by 10 times or more.

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ALeader 5D SPI

  • Full inspection coverage and 3D measurement for all types of paste deposits down to the smallest sizes of 01005 and micro-BGA pads
  • Supports fastest SMT lines, 3FOV/sec (FOV size 30.72 mm x 30.72 mm)
  • Automatic operation, fast board handling
  • Easily achievable high FPY with no escapes
  • Ultra-fast programming

5D – simultaneous 2D and 3D paste inspection

Simultaneous 2D and 3D inspection guarantees full inspection coverage with the most accurate measurement of height, area and volume of the paste deposits

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Phase Measuring Profilometry Technology

  • Superiority over traditional triangulation technology
  • High measurement accuracy
  • Noise resistance
  • High focus range

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Shadow Free

Bi-directional light projection eliminates shadow and irregular reflection effects

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Warpage free

The system accurately calculates the PCB warpage and compensates accordingly by moving the Z axis in a real-time, fully automated process

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FOV uniformity

Over 90% brightness uniformity across the FOV. High measurement accuracy is consistent throughout all parts of the PCB

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Insensitivity to the PCB color

ALeader’s SPI advanced optical system guarantees the same superior level of performance on PCBs of any color

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